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33% cotton and 2% conductive filament
MICROCHIP - APGDT001 - Serial Analyser Development Tool
MULTICOMP PRO - MCHPE-071-10-08-E - Thermoelectric Peltier Cooler Module
VCNL36826S
Driver Case Style: SSOP
B02B-PASK-1 (LF)(Sn) Header, Pa, 2WAY, Top, 2mm, W/Boss JST (Japan Solderless Terminals) 33% cotton and 2% conductiveJST (JAPAN SOLDERLESS TERMINALS) B02B PASK 1 (LF)(SN) Pin Header, Top Entry, Wire to Board, 2 mm, 1 Rows, 2 Contacts, Through Hole, PA Pitch Spacing: 2mm No. of Contacts: 2Contacts Gender: Header Product Range: PA Series Contact Termination Type: Through Hole No. of Rows: 1Rows Contact Plating: Tin Plated Contacts Contact Material: Copper SVHC: No SVHC (17 Dec 2015)
