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MULTICOMP PRO - MP008452 - Heat Sink
Kit Contents: Dev Board LPC824
VISHAY - CPF3100R00BEE36 - Through Hole Resistor
External Width: 4
PCB Hole Diameter: 1
K10-54 Sil-Pad, K-10, .006", TO-220 BERGQUIST MULTICOMP PRO - MP008452 -BERGQUIST K10 54 Thermal Pad, TO220 Insulator Body Material: PI (Polyimide) Film Thermal Conductivity: 1. 3W m. K Breakdown Voltage Vbr: 6kV Thickness: 0. 152mm Volume Resistivity: 10ohm m Thermal Impedance: 0. 86C W Dielectric Strength: Product Range: SVHC: No SVHC (27 Jun 2018) Electrical Property Ins Con: Insulative External Depth: 0. 15mm Isolation Voltage: 6kV Operating Temperature Max: 180C Operating Temperature Min: 60C Operating Temperature
US$ 21.80
US$ 21.80
US$ 13.50
US$ 98.00
