Pay in 4 interest-free payments of $6.75 Learn more
Ships within 48 hours · Estimated delivery Aug 27 - Sep 1
with two modes of plate separation and mobile phone separation
solves the problem of repairing and fixing laptop motherboards
Ripple: 10mVrms
Whether you're running a phone repair shop
Model Number:MTV1218-5MP
HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Option:HMT-X1 with two modes of plateHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.
