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Built-in Air Pressure
Connection Method: USB 3
XZZ-Z1 Smart Electric Sharpening/Engraving Polishing Pen for Phone LCD Screen Residue OCA Glue Adhesive Remover Cutter Shovel Clean Repair Tool
back cover pressure maintenance
and then touch again to start heating
TBK Laser Welding Machine for Chip Desoldering Glue Removal Option:TBK Vacuum Pen Built-in Air PressureTBK 2203 & TBK 2205 Intelligent Laser Welding Machine with HD lens and display for BGA chip desoldering, glue removal, tinning, jump wire soldering during electronic circuit board and phone motherboard repair. Laser local heating, infrared thermostat monitoring, heating area range adjustment, can be used with vacuum pen for chip desoldering. Features: 1. Intelligent laser welding machine, precision welding, intelligent control. 2. Laser local heating,
