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Upgraded MIJING Z20 Max iPhone motherboard middle layer frame tin planting fixture with BGA reballing stencil steel mesh for iPhone X/11/12/13/14/15/16/17 Pro Max motherboard soldering repair
but also better confidentiality
Insulation Pad Size: 325mm*190mm*3mm
Weight: 3kg
This product is not covered by warranty and cannot be returned
E288-02 Mini Electric Handheld Grinding Machine IC Polishing Pen Option:E288-02 Polishing Pen Upgraded MIJING Z20 Max iPhoneE288 02 small handheld grinding machine mini motherboard CPU IC polishing pen engraving tool. The electric grinding pen is suitable for mobile phone repair, IC CPU polishing, jade agate, nuclear carving, wood carving, grinding aluminum plates, printed circuit boards and epoxy boards and mobile phone LCD screen residual OCA glue removal. Features: 1. High speed, fast, convenient, fast heat dissipation. 2. Copper core motor, high concentricity, precise
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