Pay in 4 interest-free payments of $3.27 Learn more
Ships within 48 hours · Estimated delivery Sep 4 - Sep 9
Temperature range: 0~130℃
Please Note: The platform comes with iOS A10-A18 Pro stencil
net weight: 4
0 version for Mobile Phone Repair (one account can be used on three computers simultaneously
Speed regulation: Stepless speed regulation
MIJING MS1-MINI Chip Glue Removal Table Heating Platform BGA Soldering Station Temperature range: 0~130℃MIJING MS1 MINI Chip Glue Removal Table for heating and removing glue from mobile phone CPU RAM, NAND, eMMC, SSD, WIFI, and BGA chips without using hot air gun and soldering iron. Mijing MS1 MINI glue removal desoldering station, rapid heating, one button adjustment, easy and simple operation. Features: Rapid Heating: Adjustable temperature range (160C250C) for precise control. Efficient Heat Conduction: Aluminum substrate ensures fast and even
US$ 232.00
US$ 39.00
US$ 120.00
