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Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Mechanic Modern design

SKU: 34043787244

4.6
USD49.99 USD79.99

Pay in 4 interest-free payments of $12.50 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 31 - Sep 5

Description

Modern design

Reset FRP/Reactivation Lock

Works with NAND and NOR flash chip type

Multiple models screwdriver head for removing various screws in mobile phones

USB Digital Microscope Magnifier Camera Video Zoom HD 2MP PCB Inspection Endoscope with 8 LED and CMOS Sensor for Mac Windows PC Android Phone

Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Mechanic Modern designAMAOE Mbga IP WiFi Baseband CPU NAND BGA Reballing Stencil Kit Soldering Steel Mesh Platform for iPhone 7 15 Pro Max. Mbga IP 26 in 1 BGA reballing stencil platform for Planting tin & Degumming CPU, hard drive, WIFI, baseband welding Repair. Option: Mbga IP 26 in 1 set ( 7 15PM) Mbga IP 14 14P kit Positioning plate Mbga IP 12 13 kit Positioning plate Mbga IP XS 11 kit Positioning plate Mbga IP 7 8 X Qualcomm kit Positioning plate Mbga IP 7 8 X Intel

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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